VIA¿Í SIS µÎȸ»ç ¸ðµÎ À̹ø ´ë¸¸ ÄÄÇ»µ¦½º¿¡¼ ÀڽŵéÀÌÁغñÇϰí ÀÖ´Â AMD K8-Core Processors(Hammer)¿ë Ĩ¼ÂµéÀ» Àû¿ëÇÑ º¸µåµéÀ» Àü½ÃÇÒ °ÍÀ̶ó°í ÇÑ´Ù. À̵éÀº ÀÌ¹Ì ¸ðµçÁغñ¸¦ ³¡³ÂÀ¸¸ç ½ÃÀå¿¡ AMD K8-Core Processors(Hammer)°¡ Ãâ½ÃµÇ±â¸¸À» ±â´Ù¸°´Ù°í ÇÑ´Ù.
¶ÇÇÑ AMD K8-Core Processors(Hammer)µµ ÀÌÁ¦ °ð ½ÃÀåÀ» °Å¸ÇÒ °ÍÀ̶ó°í ÇÑ´Ù. VIA - VIA K8HTA : AGP4X/8X, 8X V-Link, 800MHz HyperTransport, VT8235 South Bridge, supports HDIT will come on .22 micron technology and be built using a wirebond packaging. Sampling now, mass production Q3
- VIA K8HTB : AGP 4X/8X, 8X V-Link, 800MHz HyperTransport, VT8235 South Bridge, .22 micron technology, and comes in flip chip packaging. Samples in July, mass production in Q4
- VIA K8UMA : AGP 4X/8X Zoetrope GFX, 8X V link, UMA support, .15 micron technology and a flip chip package, USB 2.0, six channel AC97 audio, 10/100 Ethernet, and support ATA 133. Samples in October, mass production in Q1 2003
SiS - SiS 755 : AGP4X/8X, USB 2.0, IEEE 1394, ATA133 SiS962, Samples in June
- SiS 760 : AGP4X/8X, USB 2.0, IEEE 1394, ATA133, SiS962, Ultra 256 graphics, Q4 2002
Ãâó : Vr-zone
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